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About Teseda - Overview
General Contacts:

E-Mail
info@teseda.com

Corporate Headquarters

USPS Mail -

Teseda Corporation
514 SW 6th Ave., Suite 500
Portland, OR 97204
USA

Telephone & Fax -

866 TESEDA1 (866 837 3321) USA
503 223 3315 telephone
503 223 3316 fax


Sales Contacts:

North America -

John Molloy
503 223 3315 X210 tel
john_molloy@teseda.com


Japan -

ATE Service Corporation
Shinji Kato

+81 44 850 8811 tel
+81 44 850 8798 fax
cat_support@ate.co.jp
www.ate.co.jp


Korea -

Daou Xilicon Technology
Co., Ltd.

82 31 789 2800 tel
82 31 705 1199 fax
eda@daouxilicon.com
www.daouxilixcon.com


Taiwan –

Jack Chen – Silicon Valley based
408-807-2133 tel
jack_chen@teseda.com

Regional Contacts:

North America:

Northern California -

Jack Chen
408-807-2133 tel
jack_chen@teseda.com


Dallas TX -

Scott Hack
408 386 9834 tel
Scott_Hack@teseda.com

Boston MA -

Jeff Remmers
Plexus Design Solutions, Inc

PO Box 570
24 Evergreen Road
Sudbury, MA 01776
978-443-1862
jeffr@plxds.com


Europe:

France -

STI - Systems and Technology
International SA
Eric Lama

33 1 45 95 44 55 tel
33 1 45 95 44 66 fax
eric.lama@stifrance.com


Germany -

HTT High Tech Trade
Rüdiger Nebatz

Landsberger Strasse 428
D-81241 München
Tel. +49 (0)89-546785-16
Mobil.: +49-172-898-3846
Fax: +49 (0)89-564396
Web: www.httgmbh.de
E-mail: rnebatz@httgmbh.de

All Other US/Canada/Europe -

John Molloy
503 223 3315 X210 tel
john_molloy@teseda.com
Spotlight
Teseda and Mentor Graphics Partner to Speed Defect Diagnosis
YieldAssist and Teseda platform linked to provide iterative diagnosis environment.
Read More >>



Ramp Yield quickly with Teseda’s Diagnostic Manager Suite


In order to first ramp, then ensure stable production and high yield of today’s semiconductor technology, it is necessary to thoroughly analyze potential factors that may lower product yield and quality. Teseda’s Diagnostic Manager suite of tools provides important information and links to the wafer production and test process:
  • Identify the physical location of an electrical test failure
  • Provide the logical information for a suspect Inspection defect
  • Rapidly determine systemic defects from random defects
  • Analyze which defects have the largest impact on yield
Whether you collect the data from Teseda’s V5xx series of Validation and Failure Analysis platforms, your own ATE, or various inspection equipment, the DM Suite can be adapted to work with your data and integrate into your environment.
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