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Cut Factory Failure Analysis Loading by as Much as 40%
Teseda’s DC Field Triage™ Package provides the user with easy to use, automated screening tools for DC related device failures. Designed for use by field personnel, the DC Field Triage Package puts device failure triage into the design and field support centers, enabling fast, timely and detailed responses to your customer’s quality concerns. Since first-level field screening is done in the field, factory failure analysis tasks are offloaded by as much as 40%. Curve tracing and DC test results are automatically saved in Microsoft Excel® spreadsheets for further analysis. Compatible with Teseda’s V550™ and V520™ benchtop test systems, the DC Field Triage Package gives the user a powerful set of automated DC failure analysis tools for field and factory users.
DC Field Triage Package
- Fast and easy curve tracing of semiconductor devices
- Built-in continuity and input leakage test measurements
- Simple operator interface
- Compare captured DC curves with “golden” results
- User interface and data logging based on industry standard Microsoft Excel® spreadsheets
- Available for either Teseda’s V550™ or V520™ benchtop engineering test systems
DC Field Triage Package Features and Benefits
| Screen for DC defects in the field | Simple DC failures can be triaged in field offices, minimizing factory returns |
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| Designed for use in both Field Support Centers and factory-based FA labs | Dramatically decreases customer response time and visibility to failure results |
| Simple Microsoft Excel-based interface | Minimal training required by field personnel — easy to use operator interface |
| Compatible with V550 and V520 systems with DC measurement options installed | Adds powerful curve-tracing features to your existing investment in Teseda tools |
Rapid Field Screening of Customer Quality Issues
With the DC Field Triage Package, catch device quality issues faster. Improve customer response turnaround time. Adopting a field-based triage screening program dramatically reduces the overall failure analysis process by eliminating “no trouble found” devices and offloading factory FA labs - shortening the overall problem to root cause cycle.